Manufacturing method of resin-sealing semiconductor device

樹脂封止型半導体装置の製造方法

Abstract

【課題】半導体素子の封止用樹脂シートの汎用性が高く、また基材テープと回路基板の位置合わせに多大な労力を費やすことがなく、さらに半導体装置端面の形状を一定とすることのできる方法を提供する。 【解決手段】複数の半導体チップ14が搭載された金属フレームよりなる回路基板10を準備し、半導体チップが各々に島状となるようにマスキング部材20,20’の貼付を行い、支持シート32と、熱硬化性の封止樹脂層34とからなる封止用樹脂シート30を準備し、封止用樹脂シートをマスキング部材が貼付された回路基板上に貼付し、マスキング部材をマスキング部材上に重なる一部の封止樹脂層ともに剥離することにより、回路基板の半導体チップを島状に樹脂封止する工程と、島状の半導体チップごとに回路基板を切断する工程とを含み、マスキング部材を剥離する前または/およびマスキング部材を剥離した後に封止樹脂層の熱硬化を行う工程を含む。 【選択図】図3
<P>PROBLEM TO BE SOLVED: To provide a method that has high universality in a resin sheet for sealing a semiconductor element, does not spend much labor for aligning a base material tape to a circuit board, and can make the shape of the end face of a semiconductor device constant. <P>SOLUTION: The method includes a process, where a circuit board 10 made of a metal frame where a plurality of semiconductor chips 14 are mounted is prepared, masking members 20, 20' are applied so that the semiconductor chips are in island shapes each, a resin sheet 30 for sealing comprising a support sheet 32 and a thermosetting sealing resin layer 34 is prepared, the resin sheet for sealing is applied onto the circuit board where a masking member is applied, the masking member is peeled with a partial sealing resin layer overlapping onto the masking member, and hence the semiconductor chips in the circuit board are sealed by resin in island shapes; a process for cutting the circuit board for each island-shaped semiconductor chip; and a process for thermosetting the sealing resin layer before peeling the masking member and/or after peeling the masking member. <P>COPYRIGHT: (C)2007,JPO&INPIT

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Cited By (3)

    Publication numberPublication dateAssigneeTitle
    JP-2014192446-AOctober 06, 2014Toray Ind Inc, 東レ株式会社Manufacturing method of electronic member
    US-8474824-B2July 02, 2013Eaton CorporationPressure sensing module having an integrated seal plate and method of assembling pressure sensing module
    WO-2010052564-A1May 14, 2010Eaton CorporationPressure sensing module having an integrated seal plate and method of assembling pressure sensing module