Double substrate structure



PROBLEM TO BE SOLVED: To provide a double substrate structure which can accommodate most of an offset upon substrate assembly, and can have no stress remaining in a terminal or a soldered part. SOLUTION: The double substrate structure has an upper substrate 4 electrically connected to a lower substrate 5, and held to be opposed to the lower substrate 5 and spaced therefrom by a predetermined interval. Holders 3b of resilient members 3 are provided to be freely moved in a direction parallel to the lower substrate 5 with the predetermined interval therebetween, and to hold the upper substrate 4 therebetween in its thickness direction. COPYRIGHT: (C)2007,JPO&INPIT
【課題】 基板組み立て時のズレをほとんど吸収し、端子やはんだ部への応力残りがないようにできる2重基板構造を提供すること。 【解決手段】 下基板5と上基板4を電気的に接続するとともに、下基板5に対して所定の間隔で対向させて配置した上基板4を保持した2重基板構造において、下基板5に対して並行な移動方向へは所定の間隙を設けて移動自在にするとともに上基板4の厚み方向を挟むように保持する弾性部材3の挟持部3bを設けた。 【選択図】 図1




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    JP-2015008215-AJanuary 15, 2015株式会社デンソー, Denso Corp電子装置